Zarlink Semiconductor

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Shipping Trays for Plastic Assembled Parts

Where we supply plastic assembled units in trays these are fully conformant to the requirements of Jedec matrix trays. Primarily thin matrix shipping trays are used for the shipment of both BGA and QFP parts. Pin 1 orientation within the trays is as per Jedec requirements.

Standard pack sizes as supplied are in 10 high tray stacks, although stack sizes can be tailored to individual requirements. Typical packing quantities per tray for the common sizes of MQFP, TQFP and BGA are as listed below.

Miniature Quad Flat Pack (MQFP)

Body Dimensions Quantity per Tray
10mm x 10mm 96
14mm x 14mm 84
14mm x 20mm 66
28mm x 28mm 24
32mm x 32mm 24
40mm x 40mm 12

Thin Quad Flat Pack (TQFP)

Body Dimensions Quantity per Tray
7mm x 7mm 250
10mm x 10mm 160
12mm x 12mm 119
14mm x 14mm 90
14mm x 20mm 72
20mm x 20mm 60
24mm x 24mm 40
28mm x 28mm 36

Ball Grid Array (BGA)

Body Dimensions Quantity per Tray
7 mm x 7mm 416
9mm x 9mm 260
11mm x 11mm 176
13mm x 13mm 160
15mm x 15mm 126
17mm x 17mm 90
19mm x 19mm, 18mm x 18mm 84
21mm x 21mm, 20mm x 20mm 60
23mm x 23mm, 22mm x 22mm 60
25mm x 25mm 44
27mm x 27mm 40
29mm x 29mm 36
31mm x 31mm 27
33mm x 33mm, 32.5mm x 32.5mm 24
35mm x 35mm 24
40mm x 40mm  21 
45mm x 45mm  12 

Tray supplied product can also be drypacked upon request to the requirements of IPC/JEDEC J-STD-033. Standard pack sizes as supplied are in 10 high tray stacks, although stack sizes can be tailored to individual requirements.

Jedec standard in 1 orientation on a Jedec Tray.


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