Prefix	Description

ZL	Zarlink Product
ZLE	Zarlink Evaluation Product (Application and Evaluation Boards, Reference Designs)
ZLS	Software

Designation	Description

Digital TV & Tuners	10,000 - 10,599
Wireless	20,000 - 20,599
Timing & Synchronization	30,000 - 30,599
Packet Switching	33,000 - 33,599
Packet Processing	36,000 - 36,599
Voice Processing	38,000 – 38,599
High Performance Analog	40,000 - 40,999
Other Network	49,000 – 49,599
TDM Switching	50,000 - 50,599
Optical	60,000 - 60,599
Medical (Ultra Low Power)	70,000 - 70,599
Special (Stamp-offs)	80,000 - 80,599
Foundry	82,000 - 82,599

Package Type	Description	Package Variant	Description	Notes

B	Board	A	Assembled	Assemble Board
D	Dual in Line	A	PDIP	Plastic Dual in Line
		B	SOJ	Small Outline J Leaded
		C	SOP/SOIC	Small Outline Package or Small Outline Integrated Circuit
		D	SSOP	Shrink Small Outline Package
		E	TSOP	Thin Small Outline Package
		F	TSSOP	Thin Small Shrink Outline Package
		G	QSOP	Quarter Pitch Small Outline Package
		H	CerDIP	Ceramic glass seal DIL
		J	DFN	Dual Flat Pack, No Lead
		K	SIDEBRAZE	Ceramic solder seal DIL
		L	SOIC {C}	Ceramic small outline I.C.
G	Grid Array	A	PBGA	Plastic Ball Grid Array
		B	MCMBGA	Multi Chip Module Ball Grid Array
		C	PGA	Ceramic Pin Grid Array
		D	LBGA	Low Profile Ball Grid Array
		E	TBGA	Thin Ball Grid Array
		F	SBGA	Super BGA - > 500 Pin count
		G	CABGA/SSBGA	Chip Array/Small Scale Ball Grid Array
		H	Flex BGA	Tape Ball Grid Array
		J	LGA	Land Grid Array
		K	HSBGA	Heat Slug Ball Grid Array
		L	WLCSBGA	Wafer Level Chip Scale BGA
		M	MCMCABGA	Multi Chip Module-Chip Array Ball Grid Array
L	Leadless Chip Carrier	A	LCC	Ceramic
		B	BCC	Bump Chip Carrier
		C	MCC/QFN	Micro Chip Carrier/Quad Flat Pack No Lead
		D	QFN	Stamped Quad Flat Pack, No Leads
		E	QFNPU	Stamped Quad Flat Package, No Leads, Paddle Up
M	Module (discrete component assembly i.e. hybrids, parallel interconnect)	A	DILC Module	Dual in Line - Ceramic Substrate
		B	SMT Module	Surface Mount - Ceramic Substrate
		C	SMTDIL Module	Surface Mount Dual in Line - Ceramic Substrate
		D	SIL Module	Single in Line - Ceramic Substrate
		E	With Electrical Connector	Module with electrical connector
		F	SIL90	Single in line 90 Bend - Ceramic Substrate
		G	BGA	Module with BGA - Printed Circuit Board
		H	With edge Contacts	Module with Edge Contacts
		J	With Elect & Opt Connector	Module with electrical and optical connector
		K	With EMI-Shield	Module with electrical and optical connector and EMI-shield
		L	With External Heatsink	Module with electrical and optical connector and external heatsink
		M	With EMI-Shield & External Heatsink	Module with electrical and optical connector, EMI-shield and external heatsink
P	Pigtail	A	Pigtail	TO-package with pigtail
		B	Ferrule	TO-package with pigtail and ferrule
		C	With SC/APC connector	TO-package with pigtail with SC/APC connector
		D	With ST connector	TO-package with pigtail with ST connector
		E	With SC connector	TO-package with pigtail with SC connector
		F	With FC connector	TO-package with pigtail with FC connector
		G	With SMA connector	TO-package with pigtail with SMA connector
		H	With LC connector	TO-package with pigtail with LC connector
		J	With MU connector	TO-package with pigtail with MU connector
		X	Customer specified pigtail #1	TO-package with customer specified pigtail #1
		Y	Customer specified pigtail #2	TO-package with customer specified pigtail #2
		Z	Customer specified pigtail #3	TO-package with customer specified pigtail #3
Q	Quad Flat Package	A	PLCC	Plastic Leaded Chip Carrier
		B	PQFP	Plastic Quad Flat Package
		C	LQFP	Low Profile Quad Flat Package
		D	TQFP	Thin Quad Flat Package
		E	HQFP	Heat Spreader Quad Flat Package
		F	JLDCC	Ceramic 'J' Leaded Chip Carrier
		G	ePad	Exposed Paddle
		H	ETQFP	Extra Thin Quad Flat Package
		J	CQFP	Ceramic Quad Flat Package
T	TO Packages	A	TO-46	TO-46 metal can with plain window
		B	TO-46	TO-46 metal can with lens
		C	TO-46	TO-46 metal can with pigtail
		D	ST	ST receptacle
		E	SC	SC receptacle
		F	FC	FC receptacle
		G	SMA	SMA receptacle
		H	ST-D	ST Duplex receptacle
		J	LC Sleeve	TO-package in LC Sleeve
		K	SC/PCB	SC Receptacle - PCB Mount
		L	FC/PCB	FC Receptacle - PCB Mount
		M	ST/Wide	ST Receptacle - Wide Body
		X	Customer specified receptacle #1	TO-package with customer specified receptacle #1
		Y	Customer specified receptacle #2	TO-package with customer specified receptacle #2
		Z	Customer specified receptacle #3	TO-package with customer specified receptacle #3
U	Un-packaged	A	Unprobed die
		B	Probed die
		C	Probed gold bumped die
		D	Probed solder bumped die

Suffix	Description

A	Tubes (Anti-static Sticks)
B	Tape & Reel Mounted
C	Trays
D	Boxed
E	Tubes, Bake & Drypack
F	Tape & Reel, Bake & Drypack
G	Trays, Bake & Drypack
H	Wafers in Wafer Carriers
J	Waffle Trays
K	Sawn Wafers on Membranes
X	Customer Specified Packing #1
Y	Customer Specified Packing #2

Option Code	Description

none	Non Pb-free terminal finish
1	Pb-free - Matte (pure) Tin (Sn) plating
2	Pb-free - Tin/Silver/Copper (Sn/Ag/Cu)
3	Pb-free - Tin/Bismuth (Sn/Bi) plating
4	not allocated as yet
A - Z	On Opto and ULP products (ZL60000 & ZL70000 series) & ZLE Items only. A – Z identifies pin-out and customer specific variants. (Refer to Data Sheet for specific details).

Code	Description

ENG	Engineering Sample identification
n	Revision numeric of the prototype