Product Nomenclature - Wireless Products (Zarlink Semiconductor)

Product Nomenclature - Wireless Products

Free format that is unique for each product.

Represents various revisions of the product starting from the letter A.

Suffix	Description

M	-55°C to +125°C (MIL Temp Range)
A	-55°C to +125°C (MIL Temp Range)
I	-40°C to +85°C (Industrial Temp Range)
C	0°C to +70°C (Commercial Temp Range)
K	Special requirement/Non-STD Temp
P	Prototype Device
R	Room Only Temperature
U	Untested
T	Waiver/Concession
D	NRE Stage Payment
NA	Not Applicable (Min temp + Screen)
-	Non Product
B	-40°C to +85°C (Industrial Temp Range)

Suffix	Description

A	PGA (Pin Grid Array)
B	Ball Grid Array
C	Cylindrical
D	Dual in line
F	Thin Quad Flat Package (TQFP)
G	Lead on 4 sides formed flat or gullwing
H	J Leaded Chip Carrier
J	J formed in line package
L	Leadless Chip Carrier
M	Miniature for small outline package
N	Small Shrink Outline Package (SSOP/TSOP)
Q	Quarter small outline package
R	Thin, leads on two sides, gullwing formed
S	Single in line
T	Thin Quad Flat Package
Y	Unformed gullwing
Z	TO plastic package

Suffix	Description

C	Metal Lid Ceramic Base
E	Epoxy sealed Ceramic
F	Ceramic based & lid Metal sealed
G	Ceramic based & lid Glass sealed
H	Plastic molded with copper heat slug
K	K-Pack
M	Metal body and Lid
P	Plastic Molded during encapsulation
Q	Special non material character
R	PCB type material
S	Silicon substrate based package

Where a product is assembled in more than one variation of a package family this character is used to uniquely define the variants.

Example: For the same product, 1 might be 7 x 7mm Body MQFP and 2 might be 10 x 10mm Body MQFP.

Suffix	Description

C	Tape & Reel non-dry pack
D	Tape & Reel non-dry pack
E	Tape & Reel non-dry pack
F	Sticks (Tubes)
G	Tape & Reel non-dry pack
K	Reel Baked & Dry Packed/Tape Mounted
N	Trays Dry Pack
P	Sticks (Tubes) dry pack
Q	Tape Mounted dry pack
R	Trays non-dry pack
S	Sticks (Tubes)
T	Tape & Reel non-dry pack
Z	Sticks (Tubes)