Zarlink Semiconductor

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ZL50117 128 Channel (4 T1/E1, 1 T3/E3/STS-1) CESoP Processor with single Ethernet interface 

Product Status - Production
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.The ZL50117 CESoP processor is a highly functional TDM to Packet bridging device providing both structured and unstructured circuit emulation services (CES) for T1 and E1 streams across a packet network based on MPLS, IP or Ethernet. The ZL50117 also supports unstructured J2, T3, E3 and STS-1. The device incorporates a range of powerful clock recovery mechanisms for each TDM stream and an Ethernet interface for data traffic uplink.

Features 

Typical Applications 

Product Information  

Document TypeTitleLast UpdatedFormat/SizeReceive via e-mail
Data sheet FileZL50115/16/17/18/19/20 CESoP Processors 23-APR-08PDF 170.1K Email FileE-mail
Application Note FileZLAN-36 - MAC-to-MAC Connections 21-SEP-06PDF 179.1K Email FileE-mail
  FileZLAN-63 - DMA Operation 22-JUN-06PDF 118.1K Email FileE-mail
  FileZLAN-134- Supporting Point to Multi-Point 29-JUL-05PDF 225.6K Email FileE-mail
  FileZLAN-61 - Supporting 1000Base-X using GMII 25-MAY-05PDF 79.5K Email FileE-mail
  FileZLAN-69 - Ethernet Port Failover 15-DEC-04PDF 101.0K Email FileE-mail
  FileZLAN-59 - Clocking Schemes for Circuit Emulation 14-DEC-04PDF 162.1K Email FileE-mail
  FileZLAN-116 - Packet Protocol Headers 14-DEC-04PDF 97.9K Email FileE-mail
Product Preview FileZL50115/6/7 CESoP Processors Product Preview 14-FEB-05PDF 137.4K Email FileE-mail
Functional Block Diagram FileZL50117 Simplified Block Diagram 01-MAY-06GIF 31.0K Email FileE-mail

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Design Information  

Document TypeTitleLast UpdatedFormat/SizeReceive via e-mail
Design Manual FileZL5011x Ethernet Bandwidth Estimator 18-AUG-05XLS 22.5K Email FileE-mail
Software Manual FileZLS50111 API User Guide 10-MAY-06PDF 926.9K Email FileE-mail
Evaluation Kit/Board Description FileCESoP Processor Evaluation Board 30-NOV-04PDF 113.5K Email FileE-mail
PCB Design Files FileZLE50111 CESoP Processor Evaluation Board Design files 16-SEP-03ZIP 2100.1K Email FileE-mail

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Models 

Document TypePart No.TitleLast UpdatedFormat/SizeReceive via e-mail
Boundary Scan ZL50117GAG FileZL50117GAG BSDL File 15-MAR-05 BSD 80.5K Email FileE-mail
IBIS Model ZL50117GAG FileZL50117GAG IBIS Model 10-DEC-04 IBS 332.1K Email FileE-mail

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Product Availability and Packaging 

Ordering Part No. Package Type No. of Pins Lead-free Option Shipping Option Lead Time (Weeks) Status
ZL50117GAG PBGA 324   Trays. Bake & Drypack 6-8 weeks Production
ZL50117GAG2 PBGA 324 Pb-free-Tin/Silver/Copper Trays. Bake & Drypack 6-8 weeks Production

Product Lead-Times when quoted are not guaranteed and are provided as a general guideline only; they may be varied from time to time without notice. Updated estimates or actual schedule commit dates will be provided at the time of order placement with Zarlink or its distributor.

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Related Products  

Part NumberDescription
Product ProfileZL50110 256 Channel (8 T1/E1) CESoP Processor with Dual Ethernet Interface
Product ProfileZL50111 1024 Channel (32 T1/E1, 2 T3/E3) CESoP Processor with triple Ethernet interface
Product ProfileZL50114 128 Channel (4 T1/E1) CESoP Processor with Dual Ethernet Interface
Product ProfileZL50115 32 Channel (1 T1/E1) CESoP Processor with single Ethernet interface
Product ProfileZL50116 64 Channel (2 T1/E1) CESoP Processor with single Ethernet interface
Product ProfileZL50118 32 Channel (1 T1/E1) CESoP Processor with dual Ethernet interface
Product ProfileZL50119 64 Channel (2 T1/E1) CESoP Processor with dual Ethernet interface
Product ProfileZL50120 128 Channel (4 T1/E1, 1 T3/E3/STS-1) CESoP Processor with dual Ethernet interface

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Product Positioning  

Document TypeTitleLast UpdatedFormat/SizeReceive via e-mail
Photographic Image FileZL50115/6/7 Product Photo 13-DEC-04JPG 12.7K Email FileE-mail

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The English language is the official language used in the Content on this Site. Zarlink is not liable for any translation of the Content created through the use of any automatic translation tool available on a third party site which this Site is hyperlinked to. The translations are provided solely for your convenience. The translations will often contain errors.


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PAGE CONTENTS
ZL50117 Datasheet
Features
Typical Applications
Product Information
Design Information
Models
Product Availability and Packaging
Related Products
Product Positioning

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TDM-to-Packet Processors > Circuit Emulation Services (CES)Product Tree
TDM-to-Packet Processors > Circuit Emulation Services (CES) Product Tree
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