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Zarlink Simplifies Design of Medical Telemetry Systems Linking Implanted
Devices and Monitoring Equipment
OTTAWA, CANADA, September 18, 2007 – Zarlink Semiconductor Inc.
(NYSE/TSX:ZL) today introduced a development kit that enables faster
design and evaluation of wireless telemetry systems linking implanted
medical devices with monitoring and programming equipment.
Medical device manufacturers are developing telemetry systems that will
support new monitoring, diagnostic and therapeutic applications to
improve patient care and lower healthcare costs. Zarlink’s ZL70101 radio
frequency (RF) transceiver chip is being designed into a range of
implanted medical devices, including pacemakers, implantable
cardioverter defibrillators (ICDs), neurostimulators, drug pumps and
physiological monitors, and associated external monitoring and
programming equipment.
The ZLE70101 Application Development Kit (ADK) demonstrates the high
data rate, ultra low-power and reliable communication link supported by
the ZL70101 transceiver. The highly integrated RF chip delivers data
rates up to 800 kbps and operates in the Medical Implant Communication
Service (MICS) 402-405 MHz band. The chip typically consumes 5 milliamps
(mA) of supply current in full operation, while incorporating a unique
“wake-up” receiver that allows the device to operate in an extremely low
current 250 nanoamp (nA) “sleep” mode.
The ZL70101 chip includes a fully featured media access controller
(MAC), designed specifically for MICS applications, that provides
forward error correction, cyclic redundancy check and retransmission to
achieve an extremely reliable data link.
“Wirelessly enabled medical devices must meet strict performance and
power demands to support new applications without impacting implanted
device battery life,” said Steve Swift, senior vice president and
general manager of Zarlink’s Medical Communications product group. “The
ZLE70101 ADK offers customers a complete hardware and firmware
evaluation platform to support the fast development of low-power,
standards-compliant medical communication systems built on field-proven
MICS technology.”
Complete hardware and firmware kit
The ZLE70101 ADK includes all hardware and firmware required to permit
customers to test the performance of the in-air communication link
between implanted devices and external equipment. A commonly used
application microcontroller is used for both the implant and base
station platforms to enable rapid integration into a customer’s specific
system design. An easy-to-use graphical user interface (GUI) running on
a Windows-based PC controls and demonstrates the capabilities of a
ZL70101-enabled medical telemetry system. The GUI interfaces to the MICS
RF boards via a USB2.0 interface.
The kit includes an Applications Development Platform (ADP100) board
that interfaces with the PC through a USB2.0 interface to either the
implant or base station mezzanine boards. The Application Implant
Mezzanine (AIM100) board performs all MICS related implant
communications. This board includes the ZL70101 transceiver, discrete
circuits including matching networks for normal data transmission and
wake-up operation, an application microcontroller connected to the
ZL70101 over an industry-standard SPI bus, and an SMA connector
interface to a PCB-based loop antenna. The board operates on an included
battery to simulate normal implant operation.
The Base Station Mezzanine (BSM100) board performs all MICS-related base
station/monitoring equipment communications processing. The board
includes the same features as the AIM100, with the addition of a wake-up
transmitter subsystem and a received signal strength indicator (RSSI)
filter for performing clear channel assessment (CCA). The BSM100 also
includes a dual-band antenna optimized for performance in the MICS band
and supporting wake-up signaling.
Also included is a MICS Test Adaptor (MT100) board that enables the
probing of key digital and analog signals for the ZL70101 chip on either
the implant or base station board. A Programmable Cable Adaptor (PCA100)
board and cable enables programming and debugging support for the
included applications microcontroller.
The ZLE70101 ADK is supported by extensive documentation, including a
ZLE70101 ADK user guide, source code overview and board-level documents
with schematics, layout, Gerber files and bill-of-material. To save
valuable time in the development process, the ADP100, AIM100 and BSM100
are fully supported by embedded firmware with thoroughly commented
source code to help developers quickly understand the programming
requirements of the ZL70101 chip while allowing for firmware reuse.
Availability
For a complete description of the ZLE70101 ADK, including block diagrams
and photos, please visit http://products.zarlink.com/product_profiles/ZL70101.htm
and download the ZLE70101 ADK Product Preview.
The ZLE70101 ADK (product order number ZLE70101 BADA) is now available for qualified customers. To learn how to become a qualified customer, please contact Zarlink Semiconductor’s Medical Communications sales team at http://ulp.zarlink.com/ulp_sales_contacts.htm. For more information on Zarlink’s ZL70101 MICS transceiver chip, please visit: http://products.zarlink.com/product_profiles/ZL70101.htm.
About Zarlink Semiconductor
For over 30 years, Zarlink Semiconductor has delivered semiconductor
solutions that drive the capabilities of voice, enterprise, broadband
and wireless communications. The Company’s success is built on its
technology strengths including voice and data networks, optoelectronics
and ultra low-power communications. For more information, visit www.zarlink.com.
Shareholders
and other individuals wishing to receive, free of charge, copies of the
reports filed with the U.S. Securities and Exchange Commission and
Regulatory Authorities, should visit the Company’s web site at www.zarlink.com
or contact Investor Relations.
Certain statements in this press release constitute forward-looking
statements within the meaning of the Private Securities Litigation
Reform Act of 1995. Such forward-looking statements involve known and
unknown risks, uncertainties, and other factors which may cause the
actual results, performance or achievements of the Company to be
materially different from any future results, performance, or
achievements expressed or implied by such forward-looking statements.
Such risks, uncertainties and assumptions include, among others, the
following: rapid technological developments and changes; our ability to
continue to operate profitably and generate positive cash flows in the
future; our dependence on our foundry suppliers and third-party
subcontractors; increasing price and product competition; our exposure
to product warranty claims resulting from product defects or failures;
and other factors referenced in our Annual Report on Form 20-F.
Investors are encouraged to consider the risks detailed in this filing.
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Zarlink and the Zarlink Semiconductor logo are trademarks of Zarlink
Semiconductor Inc.
For further information:
Edward Goffin
Media Relations
613
270-7112
edward.goffin@zarlink.com
Mike
McGinn
Investor Relations
613 270-7210
mike.mcginn@zarlink.com
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