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Zarlink’s SIP technology enables fast low cost integration of mixed
silicon technology and discrete components into an IC style package.
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Zarlink’s Microelectronics Business provides competitive advantages
for its customers by delivering smaller, smarter and more reliable
System in a Package(SIP) solutions – FAST
A unique
feature of Zarlink’s SIP is it’s inherent flexibility to incorporate
higher profile components (die stacking, filters, etc) than
typically found in a moulded SIP components.
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| | Competitive advantage through micro packaging |
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SERVICE & QUALITY
